
Advanced PCB Stackup Technology Complex Multilayer Circuit Board Impedance Control 12
Package Size10.00cm * 10.00cm * 5.00cm Package Gross Weight1.000kg Product Title: 12-Layer PCB for Enhanced Performance
Description
Basic Info.
| Model NO. | 12-layer PCB |
| Material | Fiberglass Epoxy |
| Application | Consumer Electronics |
| Flame Retardant Properties | V0 |
| Mechanical Rigid | Rigid |
| Processing Technology | Electrolytic Foil |
| Base Material | Copper |
| Insulation Materials | Organic Resin |
| Brand | Finestpcb |
| Service | One-Step PCB Service |
| Solder Mask Color | Blue.Green.Red.Black.White |
| Layer | 1-40layers |
| Min BGA Ball Pitch | 0.4mm |
| Surface Finishing | HASL\OSP\Immersion Gold |
| HASL\OSP\Immersion Gold | Fr4/Rogers/Aluminum/High Tg |
| Copper Thickness | 0.5-5oz |
| Board Thickness | 1.6 ±0.1mm |
| Minimum Hole | Minimum |
| Minimum Width | 3/3mil |
| Minimum Line | 3/3mil |
| Product Name | OEM PCB PCBA Board Assembly |
| Transport Package | Vacuum Package for Bare PCB and ESD Package |
| Specification | customized |
| Trademark | finest |
| Origin | China |
| HS Code | 8534001000 |
| Production Capacity | 30000 Pieces |
Packaging & Delivery
Package Size10.00cm * 10.00cm * 5.00cm Package Gross Weight1.000kgProduct Description
Product Title: 12-Layer PCB for Enhanced Performance
Product Benefits:
Upgrade your electronic projects with our cutting-edge 12-Layer PCB, meticulously designed for optimal performance and reliability. Explore the benefits that set our product apart:
High-Speed Connectivity: Experience seamless data transmission with the advanced architecture of our 12-layer PCB.
Enhanced Signal Integrity: Ensure your signals remain robust and stable, minimizing interference for superior overall performance.
Improved Thermal Management: The carefully engineered layers contribute to efficient heat dissipation, promoting longevity and sustained functionality.
Compact Design: Achieve more with less space as our 12-layer PCB offers increased functionality without compromising on size.
Product Features:
Product Specifications:
Layers: 12
Material: High-quality FR-4
Thickness: 1.6mm
Copper Weight: 1oz
Surface Finish: ENIG
Min Trace/Spacing: 4/4 mil
Key Features:
Advanced Multilayer Architecture
RoHS Compliant Materials
Precise Dimensional Control
Impedance Control for Signal Integrity
High-Temperature Tolerance
Elevate your electronic designs with our 12-Layer PCB, where innovation meets reliability. Upgrade today for a seamless and efficient circuit board solution.
Why choose Finest PCB Assembly?
FAQ
1. More than 19 years experience of in electronic manufacturing services for PCB making. 2. One-stop service | PCB Manufacturing | Components sourcing and PCB assembly one-stop PCBA service to help you easily achieve your electronic products. 3. More than 1000 customers working with us for telecom, IOT, RF, smart control, security, medical, industrial, automotive, 3G / 4G / 5G products. 4. Reasonable and stable price: have established a strong global electronics components supply chain that helps us get reasonable and stable price 5. Quality assurance: more than 15 years of experience in the engineering team and quality control team to ensure all products come out under control. 6. Professional replace-solution: help customers source professional replace-solution to achieve faster, lower cost with high-quality components purchasing agent service.
| PCBA Technical Capability | |
| 1. Assembly Type:: | FR4, FPC, Rigid-flex PCB, Metal base PCB. |
| 2. Assembly Specification: | Min size L50*W50mm; Max size: L510*460mm |
| 3. Assembly thickness: | Min thickness: 0.2mm; Max thickness: 3.0mm |
| 4. Components Specification | |
| Components DIP: | 01005Chip/0.35 Pitch BGA |
| Minimum device accuracy: | +/-0.04mm |
| Minimum footprint distance: | 0.3mm |
| 5. File format: | BOM list; PCB Gerber file: |
| 6. Test | |
| IQC: | Incoming inspection |
| IPQC: | Production inspection; first ICR test |
| Visual QC: | Regularly quality inspection |
| SPI test : | Automatic solder paste optical inspection |
| AOI: | SMD component welding detection, components shortage & component polarity detection |
| X-Ravd: | BGA test; QFN and other precision devices hidden PAD device inspection |
| Function test: | Test function and performance according to the customer's test procedures and steps |
| 7. Reworking: | BGA rework equipment |
| 8. Delivery Time | |
| Normal delivery time: | 24 hours( fastest 12 hours quick-turn) |
| Small production: | 72 hours( fastest 24 hours quick-turn) |
| Medium production: | 5 working days. |
| 9. Capacity: | SMT assembly 5 million points/day; plug-in & welding 300,000 points/day; 50-100 items/day |
| 10. Components Service | |
| A full set of substitute materials: | Have experience in component procurement sourcing, and management systems, and provide cost-effective services for OEM projects |
| Only SMT: | Do SMT and backhand welding according to components PCB boards provided by customers. |
| Components purchasing: | Customers provide core components, and we provide component sourcing services. |
| PCB Specification: | |||||
| PCB layers: | 1-24layers | ||||
| PCB materials: | CEM1, CEM3, Rogers, FR-4, High Tg FR-4, Aluminum Base, Halogen Free | ||||
| PCB max. board size: | 620*1100mm (Custom) | ||||
| PCB certificate: | RoHS Directive-Compliant | ||||
| PCB Thickness: | 1.6 ±0.1mm | ||||
| Layer Copper Thickness: | 0.5-5oz | ||||
| Inner Layer Copper Thickness: | 0.5-4oz | ||||
| PCB max. board thickness: | 6.0mm | ||||
| Minimum Hole Size: | 0.20mm | ||||
| Minimum Line Width/Space: | 3/3mil | ||||
| Min. S/M Pitch: | 0.1mm(4mil) | ||||
| Plate Thickness and Aperture Ratio : | 30:1 | ||||
| Minimum Hole Copper: | 20µm | ||||
| Hole Dia. Tolerance(PTH): | ±0.075mm(3mil) | ||||
| Hole dia. Tolerance(NPTH): | ±0.05mm (2mil) | ||||
| Hole Position Deviation: | ±0.05mm (2mil) | ||||
| Outline Tolerance: | ±0.05mm (2mil) | ||||
| PCB solder mask: | Black, white, yellow | ||||
| PCB surface finished: | HASL Lead-free, Immersion ENIG, Chem Tin, Flash Gold, OSP, Gold finger, Peelable, Immersion Silver | ||||
| Legend: | White | ||||
| E-test: | 100% AOI, X-ray, Flying probe test. | ||||
| Outline: | Rout and Score/V-cut | ||||
| Inspection Standard: | IPC-A-610CCLASSII | ||||
| Certificates: | UL (E503048),ISO9001/ISO14001/IATF16949 | ||||
| Outgoing Reports: | Final Inspection, E-test, Solderability Test, Micro Section, and More | ||||
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