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Mustar Advanced Multi Layer PCB Assembly for Telecommunications Medical IoT Applications Smart Devices and Components
Welcome to Mu Star (Shenzhen) Industry Co., LTD Our Advantages 1. Program and functional test and package by Free. 2. Hi
Description
Basic Info.
| Layers | Multilayer |
| Base Material | FR-4 |
| Certification | RoHS, CCC, ISO |
| Customized | Customized |
| Condition | New |
| Shape | DIP |
| Conductive Type | Bipolar Integrated Circuit |
| Integration | Gsi |
| Technics | Semiconductor IC |
| D/C | Standard |
| Warranty | 2 Years |
| Mounting Type | Standard, SMT, DIP |
| Cross Reference | Standard |
| Memory Type | Standard |
| Transport Package | Carton |
| Specification | unlimited |
| Trademark | Mustar |
| Origin | Shenzhen |
| Production Capacity | 506140 |
Product Description
Welcome to Mu Star (Shenzhen) Industry Co., LTD
Our Advantages
1. Program and functional test and package by Free. 2. High quality: IPC-A-610E standard, E-test, X-ray, AOI test, QC, 100% functional test. 3. Professional service: PCB Layout, PCB/FPC/Aluminium Making, SMT, DIP, Component Sourcing, PCB Assembly, Housing and assembly, Box Building, OEM Service. 4. Certifications: 94v-0, CE, SGS, FCC, RoHS, ISO9001, ISO14001, ISO13485, TS16949 5. The warranty period for PCBA: 2 years. 6. About Factory: 16 SMT Lines, 4 DIP Lines, 1 X-Ray, 32 AOI, 2 Sample test machines.
Specification
| 1 | Material | FR4, (High Tg FR4, General Tg FR4, Middle Tg FR4), Lead-Free Solder Sheet, Halogen Free FR4, Ceramic Filling Material, PI Material, BT Material, PPO, PPE etc. |
| 2 | Board thickness | Mass production: 394mil(10mm) Samples: 17.5mm |
| 3 | Surface finish | HASL, Immersion Gold, Immersion Tin, OSP, ENIG + OSP, Immersion Silver, ENEPIG, Gold Finger |
| 4 | PCB Max panel size | 1150mm × 560mm |
| 5 | Layer | Mass production: 2~58 layers / Pilot run: 64 layers, Flexible PCB: 1-12 Layers |
| 6 | Min hole size | Mechanical drill: 8mil(0.2mm) Laser drill: 3mil(0.075mm) |
| 7 | PCBA QC | X-Ray, AOI Test, Functional Test |
| 8 | Special Process | Buried Hole, Blind Hole, Embedded Resistance, Embedded Capacity, Hybrid, Partial hybrid, Partial high density, Back drilling, and Resistance control. |
| 9 | Our service | PCB, Turnkey PCBA, PCB Clone, Housing, PCB Assembly, Component sourcing, PCB manufacturing from 1 to 64 layers |
| 10 | Sanforized | Buried via, Blind via, Mixed Pressure, Embedded Resistance, Embedded Capacitance, Local Mixed Pressure, Local High Density, Back drill, impedance control. |
| 11 | SMT Capacity | 700 Million Points/Day |
| 12 | DIP Capacity | 5 Million Points/Day |
| 13 | Certificate | CE/RoHS/ISO9001/ISO14001/ISO13485/TS16949 |
Our Contact
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